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RELIFE RL-404 Lead-free Solder Paste Low Temperature Melting Point 138 Degrees Tin Paste Phone PCB BGA/SMD Template Repa

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RELIFE RL-404 Lead-free Solder Paste Low Temperature Melting Point 138 Degrees Tin Paste Phone PCB BGA/SMD Template Repa

Features 1 Meet the maintenance needs of motherboards for Huawei and Applee high end machines2 A low temperature lead free solder paste customized for high end motherboard repair3 RL 404 138 ° C low temperature solder pasteSpecification Model Number RL 404Melting Point 138 ° CWeight 40gPackage included 1 x Tin Paste Details Pictures

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By INR960.93
Description: Features 1 Meet the maintenance needs of motherboards for Huawei and Applee high end machines2 A low temperature lead free solder paste customized for high end motherboard repair3 RL 404 138 ° C low temperature solder pasteSpecification Model Number RL 404Melting Point 138 ° CWeight 40gPackage included 1 x Tin Paste Details Pictures

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